D-Sub高密度連接器AMPHENOL
發(fā)布時間:2023-09-06 16:40:00 瀏覽:799
AMPHENOL的D-Subminiature高密度產(chǎn)品系列為線路板和電纜線末端提供各種線接選擇,明顯減少了電纜組件和連接器整體成本。接線端子包含板側(cè)的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子,及其電纜線側(cè)的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規(guī)格都有插座和插頭連接器。
D-Sub高密度連接器直角PCB線接有兩種封裝格局款式:歐洲規(guī)劃和軍工用格局。搭配板塊接觸表面始終為金黃色,能根據(jù)所需要的充足搭配頻率選擇三種基本板厚:閃光金、15μ"和30μ"。接觸點能夠提供精密機械加工的軍工用級版本(額定電流高至7.5A)以保障安全可靠性,也能夠提供更經(jīng)濟且可商用的額定電流為3A的沖壓版本。
D-Sub高密度連接器標準系列常從A到E的5種基本機殼規(guī)格,AMPHENOL的混合連接器在數(shù)據(jù)信號、電源和同軸電纜方面具有高達18個接觸點排列。堆疊(雙端口)D-Sub高密度連接器產(chǎn)品系列相當豐富。AMPHENOL新開發(fā)的用作PIP焊接細長(或沉式或短型)系列在AMPHENOL的商業(yè)客戶中獲得成功。除此之外,AMPHENOL還可以為所有應用提供設備,包含金屬蓋、塑料防塵蓋、保護罩、組裝設備、性別轉(zhuǎn)換和其它適配器。
特征
標準D形連接器
EMI金屬外殼
插頭接地裝置凹坑
插進件由阻燃熱塑性塑料制作而成
應用商業(yè)公章接觸點
具備全方位線接范圍的變體
各種線接規(guī)格均提供插座和插頭
優(yōu)勢
確保正確的配合方位
主要用于批量生產(chǎn)但降低成本的解決方案
UL#E232356認證
兼容各種用戶需求
符合標準規(guī)范
特殊系列適合于管腳焊錫膏或回流焊接
深圳市立維創(chuàng)展科技代理經(jīng)銷AMPHENOL公司各個領域產(chǎn)品系列,在AMPHENOL,AMPHENOL相信在開展業(yè)務的過程中做出可持續(xù)的選擇可以為股東創(chuàng)造短期和長期價值。AMPHENOL的每一項業(yè)務都致力于不斷改進其設計,采購,制造和交付產(chǎn)品的方式,努力滿足或超越客戶對整個價值鏈中產(chǎn)品管理的期望。AMPHENOL 的業(yè)務將安全和環(huán)境保護作為首要任務,并根據(jù)ISO 14001和OHSAS 18001等公認標準管理這些計劃。但是,認證和法律合規(guī)性還不夠。AMPHENOL不僅僅遵守法規(guī)就能創(chuàng)造長期價值。
詳情了解AMPHENOL可點擊:http://www.imhgnv.cn/article/1321.html
PART NUMBER | DESCRIPTION |
G17DC15023313HR | Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free |
G17DD1504232GHR | G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle |
G17DD1504232RHR | G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle |
G17DD1504232SHR | G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle |
L177HDA26S | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDA26SD1CH3F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock |
L177HDA26SD1CH3R | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock |
L177HDA26SD1CH4F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock |
L177HDA26SD1CH4R | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
L177HDA26SOL2 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDA26SVF | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
L177HDAG26S | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock |
L177HDAG26SOL2RM5 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAG26SOL2RM8 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAH26SOL2 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
L177HDAH26SOL2RM5 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAH26SOL2RM8 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165") |
L177HDAH26SVF | Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut |
L177HDB44S | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDB44SD1CH3F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock |
L177HDB44SD1CH4F | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock |
L177HDB44SD1CH4R | Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock |
L177HDB44SOL2 | Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
L177HDB44SVF | Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
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